Radio Frequency Identification (RFID) Tag for an Item Having a Conductive Layer Included or Attached

ABSTRACT

An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.

RELATED APPLICATIONS

The present application is a Continuation of co-pending U.S. applicationSer. No. 12/749,355, filed Mar. 29, 2010, which is Continuation ofco-pending U.S. application Ser. No. 11/033,347 filed on Jan. 10, 2005which is a Continuation In Part of application Ser. No. 10/996,294 filedon Nov. 22, 2004, now issued as U.S. Pat. No. 7,385,284.

FIELD

The present invention relates generally to incorporating a radiofrequency (RF) transponder into a device to allow tagging for the deviceusing an RFID system.

BACKGROUND

Systems for remote identification of objects are being used for manypurposes, such as identifying an item or object in a warehouse,retailers, stores, dealerships, parking lots, airports, train stationsand/or at any particular location. Such systems use Radio Frequency (RF)signals to communicate information between an RF reader apparatus and anRF transponder (tag) attached to the item or the object. The RFtransponder includes a memory component that can store particularinformation, such as identification information (e.g., price,identification, serial number, product information, etc. . . . ) aboutthe object or the item. Many RFID systems operate based on a passivepowering system in which the RFID reader conveys energy to the RFIDtransponder. The RF transponder includes an antenna to receive theenergy conveyed from the RFID reader and transfer the energy to thememory component in order to facilitate the communication between the RFreader and the RF transponder. Some systems include both “read” and“write” functions; thus, the RF reader can read information previouslystored in the RF transponder's memory and the RF transponder can alsowrite new information into the memory in response to signals from the RFreader.

Each RF transponder has an individual code containing informationrelated to and identifying the associated object/item. In a typicalsystem, the RF reader sends an RF signal to the remote RF transponder.The antenna in the RF transponder receives the signal from the RFreader, backscatter-modulates the received signal with data temporarilyor permanently stored in the RF transponder (such as data indicating theidentity prices, and/or contents of the object/item to which thetransponder is attached), produces a sequence of signals in accordancewith the transponder's individual code, and reflects this modulatedsignal back to the RF reader to pass the information contained in the RFtransponder to the RF reader. The RF reader decodes these signals toobtain the information from the transponder. Likewise, the transpondermay decode signals received from the reader and write information to thetransponder's memory.

Tagging an object or an item is an important application. Tagging anobject or an item includes at least identifying, authenticating,recognizing, inventorying, checking-in, checking-out, tracking,locating, detecting and sensing the electronic device for many purposes.For instance, there have been many attempts to tag an item such as a CDor a DVD.CD, a DVD, a merchandise, or the like. Such tagging has beenemploying an RFID system. Attempts have been made to place an RFIDtransponder on the cover or jacket of the CD or the DVD item. However,current tagging technology employing RFID systems do not successfullyread the items/objects 100% of the time, especially without addingcomplex components to the items to booster the read accuracy.Additionally, the transponder is only placed on the jacket or cover ofthe item such as CDs/DVDs thus allowing for possible removal ortampering of the RFID transponder and possibly removing the CDs/DVDsfrom actual item from the jackets or the covers. Such possible removalthe actual CDs or DVDs items from the covers defeat the purpose oftagging. Most importantly, the current tagging technology employs only ashort range detection (13.56 MHz) thus does not provide for a long rangedetection.

Merchants, sellers, buyers, surveyors, retailers, libraries, pharmacies,hospitals, and the like who distribute, sell, or otherwise requireinformation for particular items have the need to track, tag, and/orauthenticate object/items. Thus, many people and/or entities rely onsuch tracking and tagging systems. To name a few benefits, such taggingsystem reduces operation costs or needs for manpower in tracking andtagging, increases security of the items, increases efficiency inkeeping a good inventory of the items on premises, and increasesreliability in the authentication of such items.

SUMMARY

Embodiments of the present invention pertain to an RFID transponder/tagfor an item having a conductive layer included therein. Many itemscurrently include a conductive layer in its label, packaging, protectivecover, sealing cover, or the like. Examples of such an item may includea Blister Pack, a pharmaceutical item, a medicine bottle, an electronicitem, a packaging of an item, food, toy, electronic, or non-electronicitem in a package, or any other item that can incorporate es or has aconductive layer. Embodiments of the present invention leverage theconductive layer that may already currently being included with certainitems to incorporate an RFID tag into the items. Some embodimentsincorporate an RFID tag into an item that includes the conductive layerin which the conductive layer is configured such that it can function asan antenna for an RFID tag.

One embodiment of the invention pertains to a device that comprises aconductive layer (e.g., foil or metal) formed on a first substrate. Anopening line (or two or more opening lines) is formed in the conductivelayer to make the conductive layer a part of an antenna structure. Anintegrated circuit chip is placed over at least a portion the openingline and interconnected to the conductive layer. The device can be aBlister Pack, a bottle cap, a bottle sealing, or an object that canincorporates/includes the conductive layer.

One embodiment of the invention pertains to a method that comprisescreating an opening line in a conductive layer formed on a firstsubstrate and coupling a RFID integrated circuit chip to the conductivelayer. The opening line enables the conductive layer to act as a part ofan antenna structure for an RFID device. The RFID integrated circuitchip is placed over a portion of the opening line and is electricallyinterconnected to the conductive layer. The method enables tagging,authenticating, and/or tracking an item that includes that conductivelayer and the RFID integrated circuit chip assembled according toembodiments of the present invention. An RFID tag reader is provided sothat information stored in the RFID integrated circuit chip can betransferred to and from the RFID integrated circuit chip. The RFID tagreader is also provided so that the conductive layer can receive energyfrom the reader to provide power to the RFID integrated circuit chip sothat the chip can effectuate communication between the RFID device andthe RFID reader. In one embodiment, the RFID device is formed using aweb process.

In one embodiment, the conductive layer acts as an antenna for an RFIDdevice. In another embodiment, a cap layer is placed over the conductivelayer and the RFID integrated circuit chip. In yet another embodiment,the integrated circuit chip is recessed into a second substrate, whichis then coupled to the conductive layer such that the integrated circuitchip is interconnected to the conductive layer. The integrated circuitchip may also be recessed into the second substrate via afluidic-self-assembly (FSA) process. The integrated circuit chip mayalso be recessed below a surface of the second substrate.

In some embodiments, an RFID tag is incorporated into an item thatincludes a conductive layer or a metalization layer that provides anelectrical function for the item (e.g., as in the case of a CD or a DVIDdisc). The conductive layer for such item thus cannot be altered sincethe conductive layer needs to still perform the electrical function forthe item. In such embodiments, the RFID tag is incorporated into theitem using capacitive coupling to the conductive layer. One embodimentof the invention pertains to a device that comprises a metalizationlayer and an integrated circuit chip incorporated into the devicewherein the integrated circuit chip is capacitively coupled to themetalization layer. The device comprises a first substrate having themetalization layer formed on the substrate, a cap layer covering atleast the entire metalization layer and at least a portion of thesubstrate not covered by the metalization layer. The integrated circuitchip is coupled to the first substrate, and is placed in proximity andin non-physical contact with the metalization layer. A conductive layeris attached to the integrated circuit chip. The conductive layer has atleast a portion placed in a non-physical contact with the metalizationlayer. The integrated circuit chip is capacitively coupled to themetalization layer through the conductive layer and the metalizationlayer. The integrated circuit chip is an RFID chip in one embodiment andthe metalization layer acts as the antenna that is coupled to the RFIDchip capacitively for an RFID system. The device can be a CD, CD-ROM,CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

One embodiment of the invention pertains to a device that comprises ametalization layer and an integrated circuit chip incorporated into alabel that is affixed to the device wherein the integrated circuit chipis capacitively coupled to the metalization layer. The device comprisesa first substrate having the metalization layer formed on the substrate.A cap layer covering at least the entire metalization layer. At least aportion of the substrate is not covered by the metalization layer. Thelabel is placed over the substrate. The integrated circuit chip iscoupled to the label. The integrated circuit chip is placed in proximityand in non-physical contact with the metalization layer. A conductivelayer is attached to the integrated circuit chip. The conductive layerhas at least a portion placed in a non-physical contact with themetalization layer. The integrated circuit chip is capacitively coupledto the metalization layer through the conductive layer and themetalization layer. The integrated circuit chip is an RFID chip in oneembodiment and the metalization layer acts as the antenna that iscoupled to the RFID chip capacitively for an RFID system. The device canbe a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

One embodiment of the invention pertains to a device that comprises ametalization layer and an integrated circuit chip incorporated into acenter ring substrate that is affixed to the center of the devicewherein the integrated circuit chip is capacitively coupled to themetalization layer. The device comprises a first substrate having themetalization layer formed on the substrate. A cap layer covers at leastthe entire metalization layer. At least a central portion of thesubstrate is not covered by the metalization layer. The center ringsubstrate is placed over the central portion. The center ring substratecomprises the integrated circuit chip disposed therein, a conductivelayer attached to the integrated circuit chip, and may have one or moreweight balancing components. The integrated circuit chip is placed suchthat the integrated circuit chip is in proximity and in non-physicalcontact with the metalization layer. The conductive layer has at least aportion placed in a non-physical contact with the metalization layer.The integrated circuit chip is capacitively or inductively coupled tothe metalization layer through the conductive layer and the metalizationlayer. The integrated circuit chip is an RFID chip in one embodiment andthe metalization layer acts as the antenna that is coupled to the RFIDchip capacitively for an RFID system. The device can be a CD, CD-ROM,CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.

Other embodiments of the present invention pertain to methods whichcomprise providing an electronic device. The electronic device comprisesa first substrate having a metalization layer formed on the substrate, acap layer covering at least all of the metalization layer and at least aportion of the substrate is not covered by the metalization layer. Themethods further comprise providing an RFID transponder, which comprisesidentification information for the electronic device, and providing anRFID reader receptive of the RFID transponder. The RFID transponder isincorporated into the electronic device.

The method similar to above wherein the RFID transponder includes anintegrated circuit chip coupled to the first substrate and placed inproximity and in non-physical contact with the metalization layer and aconductive layer attached to the integrated circuit chip and having atleast a portion placed in a non-physical contact with the metalizationlayer. The integrated circuit chip is capacitively or inductivelycoupled to the metalization layer through the conductive layer and themetalization layer.

The method similar to above wherein the RFID transponder includes alabel placed over the substrate, an integrated circuit chip coupled tothe label, and a conductive layer attached to the integrated circuitchip. The integrated circuit chip is placed in proximity and innon-physical contact with the metalization layer. The conductive layerhas at least a portion placed in a non-physical contact with themetalization layer. The integrated circuit chip is capacitively orinductively coupled to the metalization layer through the conductivelayer and the metalization layer.

The method similar to above wherein the RFID transponder at least acentral portion of the substrate not covered by the metalization layerand a center ring substrate placed over the central portion. The centerring substrate comprises an integrated circuit chip disposed therein. Aconductive layer is attached to the integrated circuit chip. One or moreweight balancing components may be deposited on the center ringsubstrate. The integrated circuit chip is placed such that theintegrated circuit chip is in proximity and in non-physical contact withthe metalization layer. The conductive layer has at least a portionplaced in a non-physical contact with the metalization layer. Theintegrated circuit chip is capacitively or inductively coupled to themetalization layer through the conductive layer and the metalizationlayer.

Other embodiments are also described herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B illustrate an exemplary device that can incorporate an RFIDtransponder;

FIG. 2 illustrates an exemplary RFID transponder incorporated into adevice through capacitive coupling;

FIG. 3 illustrates an exemplary RFID circuit chip in the form of afunctional block;

FIG. 4 illustrates another exemplary RFID circuit chip in the form of afunctional block;

FIG. 5 illustrates an exemplary RFID transponder incorporated into adevice through capacitive coupling;

FIGS. 6-12 illustrate exemplary configurations of a conductive layercoupled to an RFID circuit chip;

FIGS. 13-14 illustrate an exemplary device that directly incorporates anRFID transponder;

FIGS. 15-23 illustrate other exemplary devices that directlyincorporates an RFID transponder;

FIG. 24 illustrates an exemplary method of identifying a device thatincorporates an RFID transponder;

FIG. 25 illustrates an exemplary playback system for use in oneexemplary aspect of the present invention;

FIG. 26 illustrates an exemplary Blister Pack that can benefit fromvarious embodiments of the present invention;

FIG. 27 illustrates an exemplary bottle that can benefit from variousembodiments of the present invention;

FIGS. 28-29 illustrate an exemplary embodiment of incorporating an RFIDtransponder into an item in accordance to embodiments of the presentinvention;

FIGS. 30-31 illustrate an exemplary embodiment of incorporating an RFIDtransponder into a Blister Pack in accordance with embodiments of thepresent invention;

FIGS. 32-33 illustrate an exemplary embodiment of incorporating an RFIDtransponder into a bottle in accordance with embodiments of the presentinvention;

FIG. 34 illustrates an exemplary process of incorporating an RFIDtransponder into an item in accordance with embodiments of the presentinvention;

FIG. 35 illustrates another exemplary process of incorporating an RFIDtransponder into an item in accordance with embodiments of the presentinvention; and

FIG. 36 illustrates yet another exemplary process of incorporating anRFID transponder into an item in accordance with embodiments of thepresent invention.

DETAILED DESCRIPTION

Embodiments of the present invention pertain to an RFID transponder(tag) incorporated into a device, an item, and an object, such as anelectronic device, a food item, a medicine bottle, a Blister Pack, abook, or any other item that allows a conductive layer to be attachedthereto or included therein. Embodiments of the present invention alsopertain to methods of tagging, identifying, or authenticating aparticular item using the RFID transponder that is incorporated into theitem.

As mentioned above, RFID devices are currently used for remoteidentification of objects. The ability to remotely identify or detect anitem using an RFID system is important for many purposes such asidentifying/detecting an item or an object in a warehouse, retailers,stores, pharmacies, hospitals, drug stores, supermarkets, libraries,dealerships, parking lots, airports, train stations, and/or at manyother locations. An RFID system needs an RFID reader and an RFIDtransponder (tag). An antenna is typically formed on the RFIDtransponder as is know in the art. Manufacturers have been unable tomake or place an RFID transponder directly on a device that has a metalstructure included therein because an antenna structure or loop cannotbe printed on the metal and still function properly. Thus, manufacturershave been unable to incorporate a RFID transponder directly on a CD(Compact Disc), CD-ROM (Compact Disc Read Only Memory), CD-R (CompactDisc Recordable), CD-RW (Compact Disc Rewritable), CD-I (Compact DiscInteractive), DVD (Digital Video Disc or Digital Versatile Disc),DVD-ROM (Digital Video Disc Read Only), DVD-R (Digital Video DiscRecordable), and DVD-RAM (Digital Video Disc Rewritable), and otherdevices, electronic devices, or discs that include a metal structure.Additionally, manufacturers have been unable to incorporate an RFIDtransponder into a pharmaceutical packaging without substantial andcostly modification (e.g., a Blister Pack or a bottle) since currentlymany of these pharmaceutical packaging include a conductive component.One reason that the manufacturers have been unable to incorporate a RFIDtransponder directly on such devices is that the antenna for the RFIDtransponder cannot be printed on the devices directly due to theinterference by the metal structures in these devices. An antennastructure or loop gets detuned and fails to function properly whenplaced in closed proximity with or printed directly on a metalstructure. It has been thought of that when an electrical field of anytransmitter such as an antenna approaches a conductor such as a metalstructure, the transmitter goes to zero at the surface of the conductorand as such, the transmitter (antenna) gets detuned.

Embodiments of the present invention overcome the problem discussedabove. Embodiments of the present invention incorporate an RFIDtransponder directly into an electronic device that has a metalstructure included therein. The RFID transponder is said to be directlyincorporated into the device because the RFID transponder is not placedon a jacket, cover, or packaging of the device. Instead, the RFIDtransponder, after the incorporation, becomes part of the device andcannot be easily removed from the device. In one aspect, the RFIDtransponder is incorporated directly into the device by utilizing themetal structure of the device as an antenna for the RFID transponder.The RFID transponder may have more than one antenna and may use morethan one metal structure provided in the device for such antennas.Additionally, the metal structure of the device that is utilized as theantenna for the RFID transponder is capacitively or inductively coupledto an integrated circuit chip of the RFID transponder. The RFIDtransponder is formed directly on the device while utilizing an alreadyexisting metal structure on the device as an antenna structure. Thenormal function of the metal structure provided in the device is notaffected by the coupling. Additionally, the metal structure can performan additional function as an antenna structure for the RFID transponder.The RFID transponder of the embodiments of the present invention canwork in a wide range of high frequency from low to high, includingfrequency ranges from about 800 MHz to 3 GHz. The RFID transponder thusallows for longer range detection.

In one embodiment, an electronic device is any one of a CD, CD-ROM,CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, or DVD-RAM. An RFID transponderis incorporated directly on the device utilizing metalization layerprovided in each of these devices as the antenna for the RFIDtransponder. The metalization layer thus, besides performing otherpurposes for the device, also acts as the antenna for the RFIDtransponder. The RFID transponder includes an integrated circuit,typically an RFID integrated circuit (RFID IC) chip coupled to thedevice. The RFID IC chip is capacitively or inductively coupled to themetalization layer. The RFID IC chip is placed at a predetermineddistance (e.g., between about 0-3 mm) away from the metalization layerof the device so that it is in a non-physical contact with themetalization layer. The RFID IC chip may be first incorporated into astrap which is then coupled to the surface of the device. The RFID ICchip is placed sufficiently close to the metalization layer such thatenergies can easily be transferred between the RFID IC chip and themetalization layer to form the RFID transponder. This is referred to ascoupling in the embodiments of the present invention.

FIGS. 1A-1B illustrates an electronic device 100 that can benefit froman RFID transponder (tag) formed in accordance to some embodiments ofthe present invention. The electronic device 100 an be a CD, CD-ROM,CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM as shown in FIGS.1A-1B. The device 100 includes a center portion 102 and an opening 104.The opening 104 typically allows a component from a reading machine(e.g., a CD player/recorder) to be inserted therethrough for controllingand positioning the device 100. The center portion 102 is typically aplastic area or a non conductive area of the device 100. The device 100typically includes several important layers shown in FIG. 1B. The device100 includes a substrate 110, which could be the same material as thecenter portion 102 and be made of plastic. On top of the device 100 isformed a metalization layer 120. The metalization layer 120 typicallydoes not cover the center portion are 102 of the device 100. In oneembodiment, the metalization layer includes information coded thereonusing reflective and non-reflective coatings. The device 100 may alsoinclude a cap layer 140, typically a protective and non-conductive layerthat also functions to protect the metalization layer 120. The cap layer140 covers at least the entire surface of the metalization layer 120. Insome embodiments, the cap layer 140 covers also the center portion 102.In other embodiments, a label 150 is also included and placed over thedevice 100. The label 150 typically contains visible information thatidentifies and provides some information about the device, such as thename of an album or a movie recorded on the device 100. The label 150may or may not cover the entire surface of the device 100 (except theopening 104).

FIG. 2 illustrates an embodiment of the invention that pertains to adevice 201 (e.g., a CD) directly incorporates an RFID transponder on thedevice. The device 201 that comprises a metalization layer 202 and anintegrated circuit chip 208 incorporated into the device 201 wherein theintegrated circuit chip (e.g., an RFID IC chip) 208 is capacitivelycoupled to the metalization layer 202. The device 201 comprises a firstsubstrate 200 having the metalization layer 202 formed on a surface ofthe substrate 200. A cap layer 204 covering at least the entiremetalization layer 202 is also included in the device 201. The cap layer204 may also cover the portion 206. As shown in FIG. 2, in oneembodiment, at least a portion 206 of the substrate 200 is not coveredby the metalization layer 202. Similar to previously shown in FIG. 1A,the device 201 may include a center portion (which could be the portion206 shown in FIG. 2) that does not have the metalization layer 202formed thereon. In one embodiment, a label 212 providing visualinformation or display for the device 201 may be included in the device201 and is placed over the cap layer 204. The label 212 may also coverthe portion 206.

Still with FIG. 2, the integrated circuit chip 208 is coupled to thefirst substrate 200, and is placed in proximity and in non-physicalcontact with the metalization layer 202. The integrated circuit chip 208may be coupled to the portion 206, directly on the substrate 200 or onthe cap layer 204 if the cap layer 204 covers the portion 206 of thesubstrate 200. In one embodiment, the integrated circuit chip 208 isplaced at a distance between about 0 mm and about 3 mm to themetalization layer 202. The integrated circuit chip 208 is placed closeenough to the metalization layer 202 for a capacitive coupling betweenthe integrated circuit chip 208 and the metalization layer 202, but notphysically touching so as to cause the RFID transponder to not work. Inone embodiment, a conductive layer 210 is attached to the integratedcircuit chip 208. The conductive layer 210 has at least a portion beingpositioned or placed in a non-physical contact with the metalizationlayer 202. The integrated circuit chip 208 is capacitively coupled tothe metalization layer 202 through the conductive layer 210 and themetalization layer 202. The integrated circuit chip is an RFID chip, inone embodiment, and the metalization layer 202 acts as an antenna thatis coupled to the RFID chip 208 capacitively for an RFID transponder.The device can be a CD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R,and DVD-RAM.

The integrated circuit chip 208 may be deposited in a second substrate300 (FIG. 3), which is then coupled to the first substrate 200. Thesecond substrate 300 can be a plastic film, plastic sheet, or othersuitable materials. The integrated circuit chip 208 may be a functionalblock 304 having a top surface 304-T upon which a circuit element issituated (not shown). The circuit element on the top surface may be anordinary integrated circuit (IC) for any particular function. The IC maybe designed to receive power from another circuit for the operation ofan RFID transponder. The IC may also be designed to receive power froman energy source (e.g. battery) for the operation of the RFID tag. Inone embodiment, the functional block 304 has a trapezoidal cross-sectionwhere the top of the block 304 is wider than the bottom of the block304. The functional block 304 may also have other suitable/desiredshapes. The functional block 304 may be created from a host substrateand separated from this substrate. Methods of such a functional block304 are known in the art. The functional block 304 may be a NanoBlock™,which is a trademark of Alien Technology Corporation, Morgan Hill,Calif.

In one embodiment, the functional block 304 is placed in the secondsubstrate 300 (FIG. 3) using a Fluidic Self-Assembly (FSA) process. Ofcourse, other placement methods can be used. In one embodiment, thesecond substrate 300 includes a receptor 302 configured to receive thefunctional block 304. The receptor 302 may be a recessed region formedinto the second substrate 300. In the embodiment where the functionalblock 304 has the trapezoidal shape, the receptor 302 has a similarshape and/or size so that the block 304 can be deposited therein. Thereceptor 302 thus is configured with a complimentary shape for theparticular shape of the functional block 304 in one embodiment. In analternative embodiment, the functional block 304 may be pressed,recessed, or otherwise placed onto the substrate using suitable methods.The substrate 300 thus needs not have the receptor 302 formed so thatthe block 304 can be deposited therein. Instead, the block 304 can bepressed into the substrate 300.

The functional block 304 may be deposited into the receptor 302 by anFSA method described in U.S. Pat. No. 5,545,291 which is herebyincorporated by its reference in its entirety. In one embodiment, thefunctional block 304 is recessed within the second substrate 300 orplaced below or at a surface 300-S of the second substrate 300. The FSAprocess may be performed with a web material in which a web material forthe second substrate 300 is provided. The web may contain a plurality ofreceptors 302. The web material is advanced through a web processapparatus. A slurry solution (e.g., an FSA slurry) containing aplurality of functional blocks 304 is dispensed over web material. Theblocks 304 would then fall into receptors 302 formed on the webmaterial. The web material can then be sliced, singulated, separated soto form a plurality of substrates 300 each comprising one or morefunctional blocks 304.

In one embodiment, the functional block 304 includes one or more contactpads 306 so that conductive elements can be connected to the functionalblock 304. Multiple contact pads may be included so that the functionalblock 304 can be coupled to more that one antennas or other devices. Thecontact pads 306 can be formed on top of the functional block 304. Asshown in FIG. 3, a conductive layer 308 is connected to the contact pads306. In one embodiment, an insulation layer (not shown) such as aplanarization layer may be included on top of the functional block 304that has been deposited in the receptor 302. The insulation layer mayprovide a flat surface to the second substrate 300 as well as insulatecertain components on top of the functional block 304. The insulationlayer may include one to more vias (not shown) created therethrough.Electrical interconnection to the contact pads 306 would be establishedthrough the vias. Forming the insulation layer and the vias are wellknown in the art and can be done by methods including laser drilling orphotolithographic etching. The conductive layer 308 can be formed of asuitable conductors and can include metallic films, conductive polymers,or inks filled with conductive particles. The conductive layer 308 canbe formed by a method such as a subtractive process (usingetching/lithography or laser ablation) on a metal film, or an additiveprocess (such as printing) metal traces.

In one embodiment, the conductive layer 308 is a conductive trace thatextends from the functional block 304. For instance, the contact pads306 may be extended so that it also forms the conductive layer 308. Thecontact pads 306 may also be integral parts of the conductive layer 308.In one embodiment, the conductive layer 308 acts to enhance resonancefor the RFID transponder or acts as a resonator for the RFIDtransponder.

FIG. 4 illustrates an embodiment where the integrated circuit chip 208is incorporated into a second substrate 400 and recessed below a surface400-S of the substrate 400. The structure in FIG. 4 is similar to and ismade similarly to the structure in FIG. 3 in all aspects except that thestructure in FIG. 4 shows a functional block 404 recessed below thesurface 400-S. Thus, the second substrate 400 includes a receptor 402having the functional block 404 deposited therein as previouslydescribed. The functional block 404 includes contact pads 406 formed ona surface 404-T of the block 404, in one embodiment. A conductive layer408 is coupled to the contact pads 406 such that electricalinterconnection can be established to the functional block 404.

In one embodiment, the conductive layer 408 is a conductive trace thatextends from the functional block 404. For instance, the contact pads406 may be extended so that it also forms the conductive layer 408. Thecontact pads 406 may also be integral parts of the conductive layer 408.In one embodiment, the conductive layer 408 acts to enhance resonancefor the RFID transponder or acts as a resonator for the RFIDtransponder.

In one embodiment, an insulation layer (not shown) such as aplanarization layer may be included on top of the functional block 404that has been deposited in the receptor 402. The insulation layer mayprovide a flat surface to the second substrate 400 as well as insulatecertain components on top of the functional block 404. The insulationlayer is particularly helpful to provide a flat and even surface sincethe functional block 404 is recessed below the surface 400-S of thesecond substrate 400. The insulation layer may include one to more vias(not shown) created therethrough. Electrical interconnection to thecontact pads 406 would be established through the vias.

In a particular device, a metalization layer such as the metalizationlayer 202 may be formed on a non-conductive or insulation layer. FIG. 5illustrates such an embodiment. In FIG. 5, a device 501 similar to thedevice 201 includes a non-conductive layer 512 on a substrate 500 uponwhich a metalization layer 502 is formed. The metalization layer 502 isformed on the non-conductive layer 512. The non-conductive layer 512 maycover the entire surface of the substrate 500, or not. In oneembodiment, the metalization layer 502 is not formed over all of thesurface of the substrate 500 or the non-conductive layer 512 such that aportion 506 having no metalization layer 502 is provided for the device501. As before, a cap layer 504 is provided and formed over themetalization layer 502 and may also be formed over the portion 506.Additionally, a label 514 providing visual information or display forthe device 501 may be included in the device 501 and is placed over thecap layer 504 and may also be placed over the portion 506.

An RFID integrated circuit chip 508 similar to previously described(e.g., RFID integrated circuit chip 208) may be coupled to the device501 as shown in FIG. 5 or as previously described. As illustrated, theintegrated circuit chip 508 includes a conductive layer 510 that has aportion that is in a non-physical contact with the metalization layer502. As before, the RFID integrated circuit chip 508 is placed in aclose proximity but in a non-physical contact with the metalizationlayer 502. As shown in FIG. 5, the RFID integrated circuit chip 508 isplaced in the portion 506 that does not include any metalization layer502. A portion of the conductive layer 510 may very well be placed in aphysical contact with the metalization layer 502. As before, the RFIDintegrated circuit chip 508 is capacitively coupled to the metalizationlayer 502 such that the metalization 502 acts as an antenna for an RFIDtransponder for the device 501. The RFID integrated circuit chip 508 maybe deposited in a second substrate which is then adhered to the firstsubstrate 500 as previously discussed.

The conductive layer that is coupled to the RFID integrated circuit chipacts as a coupler for the transponder. The conductive layer providesadditional surface area for the RFID integrated circuit chip so that themetalization layer can capacitively or inductively couple to the RFIDintegrated circuit chip. The conductive layer for the RFID transpondermay have any configuration. The conductive layer may also act as aresonator for the RFID transponder. The conductive layer may be of astraight, curved, circular, loop, dipole structure, folded, orfolded-dipole structure, for examples.

FIGS. 6-12 illustrate a few of the exemplary configurations for theconductive layers (e.g., 210, 308, 408, and 510) that are coupled to,attached to, or formed on the RFID integrated circuit chip. FIG. 6illustrates a conductive layer 602 having a loop configuration orcircular configuration. The conductive layer 602 is coupled to contactpads 606 that are formed on an RFID integrated circuit chip 604. Asillustrated, the RFID integrated circuit chip 604 is deposited in areceptor 622 that is formed on a substrate 600. The conductive layer 602is formed on a surface 600-S of the substrate 600 and connected to theRFID integrated circuit chip 604 through the contact pads 606. In oneembodiment, the substrate 600 having the RFID integrated circuit chip602 deposited therein and the conductive layer 602 formed thereon isplaced on a substrate portion of a device (such as portions 206 and506). The substrate 600 is placed on the portion that does not comprisea metal structure or a metalization layer as previously discussed. Theconductive layer 602 may be partially touching the metalization layer ofthe device but will have a portion that is not in physical contact withthe metalization layer of the device.

FIG. 7 illustrates a conductive layer 702 with a curved configuration.FIG. 8 illustrates a conductive layer 802 with a straight configuration.FIG. 9 illustrates a conductive layer 902 with a dipole structureconfiguration. FIG. 10 illustrates a conductive layer 1002 with a foldeddipole configuration. FIG. 11 illustrates a conductive layer 1102 with acurved dipole configuration. FIG. 12 illustrates a conductive layer 1202with another example of a curved dipole configuration. It will beapparent to those skilled in the art that other structures for theconductive layer might be possible.

FIGS. 13-14 illustrate an exemplary embodiment where an RFID transponder1306 is directly incorporated into an electronic device such as a CD1300. In the present embodiment, the CD 1300 includes a center portion1302 with no conductive material or no metalization layer. The CD 1300also includes an opening 1304. FIG. 14 illustrates a cross section ofthe CD 1300 which includes a substrate 1320 which may be made of aplastic material. On the substrate 1320, a metalization layer 1322 isformed. The metalization layer 1322 is coded with information stored onthe CD 1300 using methods known in the art. The CD 1300 also includes acap layer 1324 covering at least all of the metalization layer 1322. Themetalization layer 1322 is not formed over the center portion 1302 ofthe CD 1300. The RFID transponder 1306 can be formed as previouslydescribed. In one embodiment, the RFID transponder 1306 includes asecond substrate having an RFID IC chip 1308 deposited therein aspreviously described.

In the present embodiment, the RFID transponder 1306 is placed mostly onthe center portion 1302. The RFID transponder 1306 may be placed nearthe edge of the center portion 1302 as shown in FIG. 13. The RFIDtransponder 1306 can be adhered to the center portion 1302 usingadhesive. Other techniques of coupling the RFID transponder 1306 to theCD 1300 might be possible. The RFID transponder 1306 is placed so thatthe RFID IC chip 1308 is not placed over any part of the CD 1300 thatcomprises the metalization layer 1322. Portion of the second substrateof the RFID transponder 1306 can touch or can be in a physical contactor overlap with a part of the CD 1300 that comprises the metalizationlayer 1322 without affecting the function of the RFID transponder 1306so long as the RFID IC chip 1308 is not physically contacting themetalization layer 1322. The RFID IC chip 1308 is only capacitivelycoupled to the metalization layer 1322 of the CD 1300. The RFIDtransponder 1306 utilizes the metalization layer 1322 of the CD 1300 asan antenna for the RFID transponder 1306.

In one embodiment, the CD 1300 is balanced with one or more weightbalancing components 1340. For a device such as a CD or a DVD to workwell, the weight of the device must be balanced to allow the device tospin at high speeds. The weight balancing components 1340 may bestructures that have similar weights as the RFID transponder 1306. Theweight of the weight balancing components 1340 though need not match theweight of the RFID transponder 1306 for the CD 1300 to be well balanced.The weight balancing components 1340 may be placed along the centerportion 1302 in a predetermined fashion so as to achieve balancespinning weight for the CD 1300. In some embodiments, the RFID IC chip1308 may be created so small and/or thin that balancing may not benecessary.

In one embodiment, a label, not shown may be placed over the entiresurface of the CD 1300 after the RFID transponder 1306 is incorporatedinto the CD 1300. The label may cover all areas of the CD 1300 exceptfor the opening 1304. A label for a device such as the CD 1300 is wellknown in the art. In some embodiments, the label may be the layer thatincludes the desired weight balancing components 1340 such that when thelabel is placed over the CD 1300, the weight would be balanced.

FIG. 15 illustrates another exemplary embodiment where an RFIDtransponder 1306 is incorporated into an electronic device such as a CD1300. The embodiment in FIG. 15 is similar to the embodiment show inFIG. 13 above in all aspects. In addition, in this embodiment, the RFIDtransponder 1306 includes a conductive layer 1310 which acts as acoupler or coupling extension for the RFID transponder 1306 thatprovides an extension for the RFID transponder IC chip 1308 so that theRFID IC chip 1308 can be capacitively coupled to the metalization layer1322 of the CD 1300. The conductive layer 1310 can be formed on thesecond substrate of the RFID transponder 1306 as previously described.Alternatively, the conductive layer 1310 can be formed or molded intothe CD 1300 along an area of the center portion 1302. When the RFIDtransponder 1306 is coupled or adhered to the CD 1300, the conductivelayer 1310 is electrical interconnected to the RFID IC chip 1308. Forinstance, the RFID IC chip 1308 may include contact pads (not shown)such that when the RFID transponder 1306 is coupled or embedded into theCD 1300, the conductive layer 1310 will be in a physical contact withthe contact pads.

As shown here, the conductive layer 1310 is placed on the CD 1300 suchthat at least a portion of the conductive layer 1310 is not in aphysical contact with the metalization layer.

As before, in one embodiment, the CD 1300 is balanced with one or moreweight balancing components 1340. The weight balancing components 1340may be placed along the center portion 1302 in a predetermined fashionso as to achieve balance spinning weight for the CD 1300. A label, notshown may be also placed over the entire surface of the CD 1300 afterthe RFID transponder 1306 is incorporated into the CD 1300 and theconductive layer 1310 establishing the contact with the RFID IC chip1308. The label may cover all areas of the CD 1300 except for theopening 1304. The label may also include the weight balancing components1340 as previously discussed.

FIG. 16 illustrates another exemplary embodiment where an RFIDtransponder 1306 is incorporated into an electronic device such as a CD1300. The embodiment in FIG. 16 is similar to the embodiment show inFIG. 13 or 15 above in all aspects. In addition, in this embodiment, theRFID transponder 1306 includes a conductive layer 1310 which acts as acoupler for the RFID transponder 1306 that provides an extension for theRFID transponder IC chip 1308 so that the RFID IC chip 1308 can easilybe capacitively coupled to the metalization layer 1322 of the CD 1300.The conductive layer 1310 shown in FIG. 16 has a straight configurationand includes an area that is in physical contact with a portion of theCD that comprises the metalization layer 1322. The conductive layer 1310has a portion that is not in a physical contact with the metalizationlayer. The conductive layer 1310 can be formed on the second substrateof the RFID transponder 1306 as previously described. As shown in FIG.16, the RFID IC chip 1308 includes contact pads 1312 that interconnectto the conductive layer 1310.

As before, in one embodiment, the CD 1300 is balanced with one or moreweight balancing components 1340 which may be placed in locations thatwill balance the weight for the CD 1300. A label, not shown may be alsoplaced over the entire surface of the CD 1300 after the RFID transponder1306 is incorporated into the CD 1300 and the conductive layer 1310establishing the contact with the RFID IC chip 1308. The label may coverall areas of the CD 1300 except for the opening 1304. The label may alsoinclude the weight balancing components 1340 as previously discussed.

FIG. 17 illustrates another exemplary embodiment where an RFIDtransponder 1306 is incorporated into an electronic device such as a CD1300. The embodiment in FIG. 17 is similar to the embodiment show inFIG. 13, 15, or 16 above in all aspects. In addition, in thisembodiment, the RFID transponder 1306 includes a conductive layer 1310which acts as a coupler for the RFID transponder 1306 that provides anextension for the RFID transponder IC chip 1308 so that the RFID IC chip1308 can easily be capacitively coupled to the metalization layer 1322of the CD 1300. The conductive layer 1310 shown in FIG. 17 has a dipoleand loop configuration and includes an area that is in physical contactwith a portion of the CD that comprises the metalization layer 1322. Theconductive layer 1310 has a portion that is not in a physical contactwith the metalization layer. The conductive layer 1310 can be formed onthe second substrate of the RFID transponder 1306 as previouslydescribed.

As before, in one embodiment, the CD 1300 is balanced with one or moreweight balancing components 1340 which may be placed in locations thatwill balance the weight for the CD 1300. A label, not shown may be alsoplaced over the entire surface of the CD 1300 after the RFID transponder1306 is incorporated into the CD 1300 and the conductive layer 1310establishing the contact with the RFID IC chip 1308. The label may coverall areas of the CD 1300 except for the opening 1304. The label may alsoinclude the weight balancing components 1340 as previously discussed.

FIG. 18 illustrates an exemplary embodiment where an RFID transponder1316 is incorporated directly into an electronic device such as a CD1300. In the present embodiment, the CD 1300 includes a center portion1302 with no conductive material or no metalization layer. The RFIDtransponder 1316 is formed on the center portion 1302. The CD 1300 alsoincludes an opening 1304. FIG. 14 illustrates a cross section of the CD1300 which includes a substrate 1320 which may be made of a plasticmaterial. On the substrate 1320, a metalization layer 1322 is formed.The metalization layer 1322 is coded with information stored on the CD1300 using methods known in the art. The CD 1300 also includes a caplayer 1324 covering at least all of the metalization layer 1322. Themetalization layer 1322 is not formed over the center portion 1302 ofthe CD 1300.

In the present embodiment, to form the RFID transponder 1316, an RFID ICchip 1308 is molded, embedded, placed, coupled, or otherwise adhered tothe center portion 1302. Adhesive may be used to coupled the RFID ICchip 1308 to the center portion 1302. Other techniques of coupling theRFID IC chip 1308 to the CD 1300 might be possible. The RFID IC chip1308 is not placed over any part of the CD 1300 that comprises themetalization layer 1322. The RFID IC chip 1308 is placed at apredetermined distance (e.g., between about 0.3 mm) away from the areathat comprises the metalization layer 1322. A conductive layer 1310 isinterconnected to the RFID IC chip 1308, in one embodiment, connected tocontact pads (not shown) formed on the RFID IC chip 1308. In the presentembodiment, the conductive layer 1310 is formed directly on the centerportion 1302. The conductive layer 1310 may be embedded, placed,coupled, or otherwise adhered to the center portion 1302. At least someportions of the conductive layer 1310 are not in a physical contact withor overlap with a part of the CD 1300 that comprises the metalizationlayer 1322. The RFID IC chip 1308 is only capacitively coupled to themetalization layer 1322 of the CD 1300 via the conductive layer 1310. Asbefore, the RFID transponder 1316 utilizes the metalization layer 1322of the CD 1300 as the antenna for the RFID transponder 1316.

In one embodiment, the CD 1300 is balanced with one or more weightbalancing components 1340. The weight balancing components 1340 may beplaced along the center portion 1302 in a predetermined fashion so as toachieve balance spinning weight for the CD 1300. In one embodiment, alabel, not shown may be placed over the entire surface of the CD 1300after the RFID transponder 1316 is formed on the CD 1300. The label maycover all areas of the CD 1300 except for the opening 1304. The labelmay also include the weight balancing components 1340 as previouslymentioned.

FIGS. 19-20 illustrate an exemplary embodiment where an RFID transponder1306 is directly incorporated into an electronic device such as a CD1300. In the present embodiment, the CD 1300 includes a center portion1302 with no conductive material or no metalization layer. The CD 1300also includes an opening 1304. FIG. 20 illustrates a cross section ofthe CD 1300 which includes a substrate 1320 which may be made of aplastic material. Optionally, on the substrate 1320, a non-conductivelayer 1344 is provided. On the substrate 1320 (or on the non-conductivelayer 1344), a metalization layer 1322 is formed. The metalization layer1322 is coded with information stored on the CD 1300 using methods knownin the art. The CD 1300 also includes a cap layer 1324 covering at leastall of the metalization layer 1322. The metalization layer 1322 is notformed over the center portion 1302 of the CD 1300.

In one embodiment, an RFID transponder 1306 is formed on or includedinto a label 1330 of the CD 1300 (FIG. 20). In the present embodiment,an RFID IC chip 1308 is embedded into the label 1330 using methods knownin the art (e.g., FSA). The chip 1308 may also be placed into the label1330 using other methods. The label 1330 may be a second substrate aspreviously described and include a receptor configured to receive thechip 1308. The chip 1308 may also be adhered to the label 1330 using aconvenient technique such as using adhesive. A conductive layer 1310 isthen formed on the label 1130 and interconnected to the chip 1308. Thechip 1308 may include contact pads (not shown) that the conductive layer1310 is connected to. A planarization layer (not shown) may be placedover the side label 1330 to provide a smooth surface and a protectivelayer for the chip 1308. In an alternative embodiment, the conductivelayer 1310 is formed on the CD 1300 and is connected to the chip 1308when the label 1330 is placed over the CD 1300. The label 1330 is thenplaced over the CD 1300. The label 1330 has a portion 1331 that overlapswith the center portion 1302 when the label 1330 is placed over the CD1300. The chip 1308 and portions of the conductive layer 1310 is formedin the portion 1331 such that when the label 1330 is placed over the CD1300, the chip 1308 is not in a physical contact with a part of the CDthat comprises the metalization layer 1322. Additionally, when the label1330 is placed over the CD 1300, a portion of the conductive layer 1310is also not in a physical contact with the part of the CD that comprisesthe metalization layer 1322. In one embodiment, the conductive layer1310 has a circular configuration and does not have a part that overlapsthe part of the CD that comprises the metalization layer 1322. The RFIDtransponder 1306 forms a capacitive coupling to the metalization layer1322 utilizing the metalization layer 1322 as an antenna layer.

In one embodiment, the RFID transponder 1306 can be formed as previouslydescribed and then laminated or otherwise coupled to the label 1330(FIG. 21). In the present embodiment, the RFID transponder 1306 includesa second substrate 1380 having an RFID IC chip 1308 deposited therein.The RFID transponder 1306 also includes a conductive layer 1310 formedon the second substrate 1380. The second substrate 1380 with all thenecessary components is then laminated or adhered to the label 1330 asshown in FIG. 21. The label 1330 is then placed over the CD 1300. Thelabel 1330 has a portion 1331 that overlaps with the center portion 1302when the label 1330 is placed over the CD 1300. The RFID transponder1306 is laminated or adhered to the portion 1331 such that when thelabel 1330 is placed over the CD 1300, the chip 1308 is not in aphysical contact with a part of the CD that comprises the metalizationlayer 1322. Additionally, when the label 1330 is placed over the CD1300, a portion of the conductive layer 1310 is also not in a physicalcontact with the part of the CD that comprises the metalization layer1322. In one embodiment, the conductive layer 1310 has a circularconfiguration and does not have a part that overlaps the part of the CDthat comprises the metalization layer 1322. The RFID transponder 1306forms a capacitive coupling to the metalization layer 1322 utilizing themetalization layer 1322 as an antenna layer.

In one embodiment, the CD 1300 is balanced with one or more weightbalancing components 1340 as previously mentioned. The weight balancingcomponents 1340 may be placed on the label 1330, for example, along theportion 1331 of the label 1330. Alternatively, the weight balancingcomponents 1340 may be placed along the center portion 1302 in apredetermined fashion so as to achieve balance spinning weight for theCD 1300 after the label 1300 is affixed thereto.

FIGS. 22-23 illustrate an exemplary embodiment where an RFID transponder1366 is incorporated into an electronic device such as a CD 1300. In thepresent embodiment, the CD 1300 includes a center portion 1302 with noconductive material or no metalization layer. The CD 1300 also includesan opening 1304. FIG. 4 illustrates a cross section of the CD 1300 whichincludes a substrate 1320 which may be made of a plastic material. Onthe substrate 1320, a metalization layer 1322 is formed. Themetalization layer 1322 is coded with information stored on the CD 1300using methods known in the art. The CD 1300 also includes a cap layer1324 covering at least all of the metalization layer 1322. Themetalization layer 1322 is not formed over the center portion 1302 ofthe CD 1300.

As illustrated in FIG. 23, in one embodiment, an RFID transponder 1366includes a center ring structure or substrate 1350 which is placed onthe center portion 1302 of the CD 1300. The center ring structure 1350includes an RFID IC chip 1305 incorporated therein. In the presentembodiment, the RFID IC chip 1308 is embedded into the center ringstructure 1350 using methods known in the art (e.g., FSA). The chip 1308may also be placed into the center ring structure 1350 using othermethods. The center ring structure 1350 is a second substrate that isadhered, coupled, or otherwise attached to the substrate 1320 of the CD1300 at the center portion 1302. The center ring structure 1350 includesa receptor (not labeled) that may be configured to receive the chip1308. Alternatively, the chip 1308 may also be adhered to the centerring structure 1350 using a convenient technique such as using adhesive.A conductive layer 1310 is then formed on the center ring structure 1350and interconnected to and extended from the chip 1308. The chip 1308 mayinclude contact pads (not labeled) that the conductive layer 1310 isconnected to. The center ring structure 1350 is placed over the CD 1300at the center portion 1302. The center ring structure 1350 may cover theentire center portion 1302 or may only cover a portion of the centerportion 13002. The center ring structure 1350 is placed on the CD 1300such that the chip 1308 and portions of the conductive layer 1310 arenot in physical contacts with a part of the CD that comprises themetalization layer 1322. In one embodiment, the conductive layer 1310has a circular configuration and does not have a part that overlaps thepart of the CD that comprises the metalization layer 1322. The RFIDtransponder 1366 forms a capacitive coupling to the metalization layer1322 utilizing the metalization layer 1322 as an antenna layer.

In one embodiment, the RFID transponder 1366 includes one or more weightbalancing components 1340 similar to previous embodiments (FIGS. 22-23).The weight balancing components 1340 may be placed or embedded directlyinto the center ring structure 1350. Alternatively, the weight balancingcomponents 1340 may be placed along the center portion 1302 in apredetermined fashion so as to achieve a balance spinning weight for theCD 1300 after the RFID transponder 1366 is affixed thereto.

In one embodiment, a label, not shown may be placed over the entiresurface of the CD 1300 after the RFID transponder 1366 is incorporatedinto the CD 1300. The label may cover all areas of the CD 1300 exceptfor the opening 1304.

FIG. 24 illustrates an exemplary method 2300 of processing an electronicdevice in accordance to embodiments of the present invention. Theelectronic device may be a CD 1300 or other electronic device such as aCD, CD-ROM, CD-R, CD-RW, CD-I, DVD, DVD-ROM, DVD-R, and DVD-RAM.Processing the device includes tagging which may include, but is notlimited to identifying, authenticating, recognizing, inventorying,checking-in, checking-out, tracking, locating, and sensing theelectronic device. In the embodiments of the present invention, taggingis achieved using an RFID system comprises using an RFID reader and anRFID transponder made in accordance to embodiments of the presentinvention. At box 2302, an electronic device with identificationinformation for the electronic device is provided. As previouslydescribed, the electronic device comprises a first substrate having ametalization layer formed on the substrate, a cap layer covering atleast all of the metalization layer and at least a portion of thesubstrate is not covered by the metalization layer. At box 2304, an RFIDtransponder according to embodiments of the present invention isobtained. The RFID transponder is incorporated into the device aspreviously described. The RFID tag includes an RFID circuit chip that iscapacitively coupled to the metalization layer thus creating the RFIDtransponder. At box 2306, an RFID reader receptive of the RFIDtransponder is provided. The RFID transponder comprises theidentification information and is incorporated into the electronicdevice.

In another embodiment, a method similar to method 2300 is provided. Themethod similar to method 2300 except that the RFID transponder includesthe integrated circuit chip coupled to the first substrate and placed inproximity and in non-physical contact with the metalization layer and aconductive layer attached to the integrated circuit chip and having atleast a portion placed in a non-physical contact with the metalizationlayer. The integrated circuit chip is capacitively coupled to themetalization layer through the conductive layer and the metalizationlayer.

In another embodiment, a method similar to method 2300 is provided. Themethod similar to method 2300 except that the RFID transponder includesa label placed over the substrate, an integrated circuit chip coupled tothe label, and a conductive layer attached to the integrated circuitchip. The integrated circuit chip is placed in proximity and innon-physical contact with the metalization layer. The conductive layerhas at least a portion placed in a non-physical contact with themetalization layer. The integrated circuit chip is capacitively coupledto the metalization layer through the conductive layer and themetalization layer.

In another embodiment, a method similar to method 2300 is provided. Themethod similar to method 2300 except that the RFID transponder is formedin a center ring substrate as previously described. At least a centralportion of the substrate not covered by the metalization layer and acenter ring substrate placed over the central portion. The center ringsubstrate comprises an integrated circuit chip disposed therein. Aconductive layer is attached to the integrated circuit chip. One or moreweight balancing components are deposited on the center ring substrate.The integrated circuit chip is placed such that the integrated circuitchip is in proximity and in non-physical contact with the metalizationlayer. The conductive layer has at least a portion placed in anon-physical contact with the metalization layer. The integrated circuitchip is capacitively coupled to the metalization layer through theconductive layer and the metalization layer.

In one embodiment, an electronic device such as a CD or DVD is taggedusing an RFID transponder that is incorporated directly into theelectronic device in accordance to exemplary embodiments of the presentinvention. In one embodiment, a CD or DVD is tagged using such RFIDtransponder.

In another embodiment, a device such as a CD or DVD that is tagged usingan RFID transponder that is incorporated directly into the electronicdevice is checked in or out of a library using a complimentary RFIDreader, wherein the RFID transponder includes information oridentification information about the device and communicates/transmitsthe information the RFID reader, which identifies the informationaccordingly and facilitates the checking in and/or checking out of theitem. In one embodiment, when the device is returned to the library, theRFID reader picks up the information from the RFID transponderincorporated on the device and automatically identifies and facilitatesthe check in process of the device at the library.

In one embodiment, the RFID transponder functions as a security devicefor an electronic device that incorporates the RFID transponder directlyinto the electronic device. The RFID transponder sends a signal to asecurity gate which includes an RFID reader and is positioned at aparticular location as the device passes through the gate. The RFIDtransponder allows the device to be detected and/or checked out. Suchsecurity gate may be included at a retailer selling the device, a rentalstore renting the device, or a library maintaining the device.

In one embodiment, the RFID transponder enables automatic check inand/or check out of an electronic device that incorporates the RFIDtransponder directly into the electronic device. When an RFID reader isprovided, the device with the RFID transponder can be automaticallydetected for checking in and checking out process.

In one embodiment, the RFID transponder facilitates sorting of a devicereturned to a particular location such as a library or a rental store.When an electronic device includes an RFID transponder that isincorporated directly into the device, when the device is return toappropriate location where an RFID reader is placed, the item isdetected and automatically checked in. In one embodiment, an RFID-enableautomatic sorter is provided. The RFID-enable automatic sorter picks upsignal from the RFID transponder on the device, automatically checks inthe device, and automatically sorts and/or places the device into anappropriate location/container according to the information provided inthe RFID transponder.

In one embodiment, the RFID transponder facilitates shelving,organizing, locating, identifying, or tracking, or other similar task anelectronic device that incorporates the RFID transponder directly intothe electronic device. An RFID reader is provided. The RFID reader canscan or pick up signals from the device's RFID transponder and enters orchecks the location of the device which facilitates shelving,organizing, locating, identifying, tracking, or other similar task ofthe device.

Other aspects of the invention relate to content protection. Forexample, an RFID IC may be integrated with a device such as a CD or DVDand may, (in addition to or an alternative to identifying, through acontactless, wireless manner, the particular CD or the content on theCD) provide a way to prevent successful copying of the CD, DVD, or othermachine readable medium. In this example, the RFID IC is embedded withinthe CD itself and may be read by a reader in the CD player. The RFID ICmay transmit a code (which may be encoded or encrypted) to the reader inthe CD player (or within the system which includes the CD player), andthe CD player can process this code to determine whether the CD isauthentic (and not a pirated copy). There are numerous possibleimplementations for protecting the content of a CD or other machinereadable media with an RFID IC embedded within the storage medium suchas a CD.

One implementation may merely involve wireless by reading a code orvalue from the RFID IC when the machine readable medium (which containsthe RFID IC) is placed into a playback device (e.g., a CD player) andcomparing this code or value to a code or value read from the machinereadable medium. If the codes or values match, then the playback device“knows” that the machine readable medium is authentic. If the codes orvalues do not match, then the playback device “knows” that the machinereadable medium is NOT authentic and the playback device will refuse toplayback (or otherwise interact with) the medium and may cause themedium to be ejected. The playback device would normally include astandard playback device (e.g., a CD laser and head and associatedelectronics and motors) and an RFID reader which transmits aninterrogation signal to the RFID IC in the machine readable medium andwhich receives a response from the transponding RFID IC which isembedded with the machine readable medium which is inserted into theplayback device.

FIG. 25 shows an example of a playback system for use in one exemplaryaspect of the invention. The playback system 2501 may be a stand-aloneCD player or DVD player or may be part of a larger system (e.g., theplayback system 2501 may be a CD/DVD drive in a general purpose computersystem). The playback system 2501 is designed to receive a machinereadable medium 2503 (which may be a CD, DVD, etc.) which includes anRFID IC 2502. The RFID IC 2502 includes one or more codes or valueswhich identify the medium and which can also be used to preventsuccessful copying of the content stored on the medium. A drive system2505 receives the medium 2503 and positions the medium 2503 relative toa read head (e.g., a CD laser and detector head). The drive system 2505is coupled to and controlled by the control logic 2509. The controllogic 2509 controls the drive system 2505 and also controls theoperation of and receives signals (e.g., codes or values) from the RFIDreader 2507. These signals are obtained from the RFID IC. TheInput/Output (“I/O”) control 2511 is coupled to the control logic 2509in order to provide an output and/or input to the playback system 2501.The I/O control 2511 may receive audio or audiovisual data from themedium 2503 and provide this data to speakers or a display device or toanother subsystem (e.g., portions of a computer or TV). The controllogic 2509 may perform the comparisons described above (e.g., matching acode from the RFID IC with a code stored in the medium 2503) in order toverify that the medium is authentic. Other alternative playbackarchitectures may be implemented with an RFID reader which reads an RFIDIC embedded with a machine readable medium.

Another exemplary implementation may, rather than merely determiningwhether a value read from the RFID IC matches a value read from themachine readable medium which contains the RFID IC, use an encodingscheme or encryption scheme to make copying difficult. One or morevalues stored in the RFID IC may be encoded and/or encrypted and one ormore values stored on the machine readable medium may also be encodedand/or encrypted, and the playback device processes these values todetermine whether the content of the machine readable medium isauthentic. For example, if each CD or other medium from a particularsource (e.g., Microsoft) has a serial number, that serial number may beencrypted (e.g., with a private key of a public key/private key system)and stored in the RFID IC. When the playback device reads the RFID IC,it retrieves this encrypted serial number and decrypts this number(e.g., with the source's public key) to obtain the unencrypted (“clear”)serial number and compares this serial number from the RFID IC to theserial number stored on the medium. If there is a match then the mediumis authentic and if there is no match then it is not authentic. Numerousother encoding schemes or encryption schemes which are known in the artmay alternatively be applied.

Several embodiments discussed above pertain to incorporations of an RFIDtransponder into an electronic item that includes therein a metalizationlayer. The metalization layer of such electronic item performsparticular functions (e.g., storing information and executinginstructions) and as such should not be altered. In another group ofembodiments, an RFID transponder is incorporated into an item that mayinclude or otherwise allow a conductive layer or a metalization layer tobe attached to the item. The conductive layer for this item may notnecessarily perform any electronic function such as the metalizationlayer for a CD disc previously discussed. The conductive layer for thisitem may function as a tampered proof, protective, cover, a sealing, oran identification layer or label for an item or a packaging of an item.In these embodiments, the conductive layer itself may be physicallyaltered or configured so that the conductive layer can act as a part ofan antenna and/or a resonance structure for an RFID transponder. Withsuch physical alteration, the conductive layer can then have anadditional function, to act as a part of an antenna and/or a resonancestructure for the RFID transponder. An RFID integrated circuit chip isinterconnected to the conductive layer to form an RFID transponder. Theitem with such RFID transponder included can then be tagged,authenticated, tracked, or the like using an RFID system as previouslydescribed. These embodiments are particularly useful to incorporate anRFID system into a pharmaceutical item, a Blister Pack, a medicinebottle, a food item, a bottle, or any other merchandise that maycurrently include a conductive layer such as a foil layer in itspackaging.

Currently, numerous items are being packaged in tamper-proof packagingthat includes a foil layer or other conductive material. Such itemsinclude medicine, personal product (e.g., toothpaste, mouthwash,cosmetic product), food, wine, cellular/wireless device, memory card,electronic device, etc. It is typical to find a foil sealing over anopening of a bottle or a tube that contains a product wherein breakagein the sealing would indicate that the product has been opened, used,tested, or otherwise tampered with. It is also typical to find a productpackaged in a Blister Pack or a Blister Pack like packaging that includea metallic or a foil layer. In many instances, these types of packagingor sealing also allow for displays of the item or product containedwithin the packages as well as providing security or authenticity of theitem, theft resistant or indicator for the item, and/or tamper-proofpackaging for the item.

FIG. 26 illustrates a typical blister pack 1000 that includes athermoformed “blister” or tray 1002 which houses an item or product or aplurality of such item or product 1004. A “blister card” or cover 1006,which may be a printed card with an adhesive coating, is adhered on thefront surface of the tray 1002. The blister/tray 1002 is attached to theblister card/cover 1006 using a machine that may also be used to packagethe product between the tray and the cover. The blister pack can be assmall or as large as desired for the particular product. The blisterpack typically includes a foil layer, which could be the cover 1006 inmany instances. In accordance to embodiments of the present invention,this foil layer is made to include one or more slots and an RFIDintegrated circuit chip placed over a portion of the slot (see below,FIGS. 28-31). The foil layer functions as a part of an antenna and/orresonator and together with the RFID integrated circuit chip functionsas an RFID transponder.

FIG. 27 illustrates a medicine bottle 2000 that may include a tamperedproof foil layer 2002. The bottle 2000 typically stores a particularmedicine. To ensure that a consumer purchase an un-opened or untamperedbottle, a sealing cover such as the foil layer 2004 is placed over themouth or opening of the bottle 2000. A cap/cover 2006 is also typicallyplaced over the bottle 2000. In accordance to embodiments of the presentinvention, this foil layer 2004 can be made to include one or more slotsand an RFID integrated circuit chip placed over a portion of the slot(see below, FIGS. 32-33). The foil layer functions as a part of anantenna and/or resonator and together with the RFID integrated circuitchip functions as an RFID transponder. Similar implementations can beapplied to other items such as food, cosmetic products, or personalproducts.

FIG. 28 illustrates an exemplary embodiment of a conductive layer 2804(e.g., a foil layer) that is configured so that it can function as apart of an antenna structure for an RFID device 2800. Additionally, theconductive layer 2804 can also be configured to be a part of or aresonator for the RFID device 2800. In the present embodiment, the RFIDdevice 2800 (also referred to as an RFID tag or transponder) comprises asubstrate 2802 upon which the conductive layer 2804 is formed. Theconductive layer 2804 includes an opening line or slot 2812. The openingline 2812 is typically a slot cut through a portion of the conductivelayer 2804. The slot 2812 transforms the conductive layer 2804 into apart of an antenna structure that can be used for an RFID system. Theopening line 2812 can be etched, laser cut, or otherwise formed into theconductive layer 2804 using methods known in the art. The opening line2812 can also function as a separator that creates two sides for theconductive layer 2804 so that the conductive layer 2804 can function asa part of an antenna and can be coupled to a circuit component withoutshorting out. The opening line 2812 also allows the conductive layer2804 to be configured like a loop or two-plates antenna. In oneembodiment, the opening line 2812 has a width of about 0.5-5 mm.

In one embodiment, an additional opening line 2813 is formed in theconductive layer 2804. The additional opening line 2813 can extend fromthe opening line 2812 or can intersect with the opening line 2812 asillustrated in FIG. 28. In one embodiment, the additional opening line2813 functions as a resonator for the RFID tag 2800. The length of theopening line 2813 corresponds to a particular frequency that the RFIDtag 2800 is to be operated in. For instance, for an operating frequencyof about 800-950 MHz, the opening line 2813 may have a length of about1-1.5 inches. The length of the opening line 2813 is inverselyproportional to the operating frequency level for the RFID tag 2800. Inanother example, for an operating frequency of about 2-3 GHz, theopening line 2813 may have a length of about 0.2-0.5 inches.

As illustrated in FIG. 28, an RFID integrated circuit chip 2808 isplaced over a portion of the opening line 2812. The RFID integratedcircuit chip 2808 is electrically interconnected to the conductive layer2804. The RFID integrated circuit chip 2808 can be similar to thecircuit chip 304 (FIG. 3) previously discussed. The RFID integratedcircuit chip 2808 can be a conventional integrated circuit configured towork for an RFID system.

In one embodiment, the RFID integrated circuit chip 2808 is placed,deposited, or recessed in a strap substrate 2808 (FIG. 29) prior tobeing interconnected to the conductive layer 2804. In one embodiment,the strap substrate 2808 is provided. The strap substrate 2808 mayinclude a receptor (not labeled) configured to receive the RFIDintegrated circuit chip 2808 in the form of a block that include thenecessary circuit or electrical component formed thereon (similar topreviously discussed with reference to FIGS. 3-4). The RFID integratedcircuit chip 2808 may be deposited into the receptor using FSA aspreviously discussed (FIG. 29). Alternatively, the RFID integratedcircuit chip 2808 is recessed into the strap substrate 2808 using othersuitable methods or techniques. The RFID integrated circuit chip 2808may include one or more contact pads 2814 used to electricallyinterconnect the electrical component to the conductive layer 2804.Additional contact pads may also be included for other purposes. In someembodiments, the RFID integrated circuit chip 2808 may include aninterconnect feature 2816 to provide additional contact area for theRFID integrated circuit chip 2808. The interconnect feature 2816 mayalso increase or act as a resonator for the RFID tag that the RFID ICchip 2808 is included or coupled to. After the RFID integrated circuitchip 2808 is deposited into the strap substrate 2808, the strapsubstrate 2808 is placed over the opening line 2812 as illustrated inFIGS. 28-29. In one embodiment, the strap substrate 2808 is placedupside down so that the RFID IC chip 2810 is facing the conductive layer2804.

In one embodiment, a protective layer or a cap layer 2806 is placed overthe substrate 2802 as illustrated in FIG. 28. The protective layer 2806serves to prevent damages to the RFID integrated circuit chip 2808 aswell as the conductive layer 2804. The protective layer 2806 can alsofunction to serve as a sealing or a tamper-proof indicator since a slotor an opening is formed into the conductive layer 2804.

Adhesive layers (not shown) may be used to couple the substrate 2802 tothe conductive layer 2804 and/or to couple the conductive layer 2804 tothe protective layer 2086. Additionally, adhesive may also be used tocouple the RFID integrated circuit chip 2808 to the conductive layer2804 as previously discussed. Other methods or mechanical coupling canalso be used, e.g., soldering.

The conductive layer 2804 described can be incorporated or build into aBlister Pack for a pharmaceutical product as previously mentioned. FIGS.30-31 illustrate an exemplary embodiment of a pharmaceutical productthat includes a Blister Pack with an RFID tag made in accordance toembodiments of the present invention. As illustrated in FIGS. 30-31, aconductive layer (or a foil layer) 3002 is provided with a slot 3004 anda slot 3006. An RFID integrated circuit chip 3008 is placed over aportion of the slot 30046. The conductive layer 3002 is placed over asubstrate 3014. The substrate 3014 is a tray with feature 3012 that isconfigured to house a medicine tablet or a plurality of medicine tablets3010. In one embodiment, when the conductive layer 3002 and thesubstrate 3014 are adhered to each other, the tablets 3010 are housedbetween the conductive layer 3002 and the substrate 3014 as shown inFIG. 31. A protective layer 3016 may also be placed over the conductivelayer to protect the conductive layer 3002 and the RFID integratedcircuit chip 3008. In another embodiment, the conductive layer 3002 isthe layer with the features 3012 that can receive the tablets 3010. Inyet another embodiment, the conductive layer 3002 is simply a label ofthe Blister Pack.

FIGS. 32-33 illustrates an exemplary embodiment of a conductive layer2004 (e.g., a foil layer) that is altered so that it can function as apart of an antenna and/or a resonator structure and can accommodate andinterconnect to an RFID integrated circuit chip 2018 for an RFID device2001. The RFID device 2001 also functions as a protective sealing or asealing cap for an item such as the medicine bottle 2000 shown in FIG.27. In the present embodiment, the bottle 2000 includes a sealing layerthat includes a conductive layer 2004 placed over the opening 2010 ofthe bottle 2000. The bottle 2000 may include a bottle neck 2008 as istypically known in the art.

In one embodiment, to provide the bottle 2000 with an RFID device 2001,a substrate layer 2016 is placed over the opening 2010. A conductivelayer (e.g., a foil layer) 2004 is placed over the substrate 2016. Aslot 2012 is created in the conductive layer 2004. As previouslymentioned, the slot 2012 created into the conductive layer 2004 enablesthe conductive layer 2004 to be configured to be a part of an antennastructure for the RFID device 2001. An RFID integrated circuit chip 2018is placed over the slot 2012 to interconnect the RFID integrated circuitchip 2018 to the conductive layer 2004. Additional slot such as slot2016 can also be included to add resonance to the RFID device 2001. Thelength of the slot 2016 corresponds to the desired frequency for theRFID device. In one embodiment, the slot 2016 has a length of about1-1.5 inches which will enable the RFID device 2001 to operate in therange of about 800-950 MHz. In one embodiment, the slot 2016 has alength of about 0.2-0.5 inches which will enable the RFID device 2001 tooperate in the range of about 2-3 GHz. In one embodiment, the RFIDintegrated circuit chip 2018 is recessed within a strap substrate 2014as previously discussed. The strap substrate 2014 is then placed overthe slot 2012 in a way that enable the RFID integrated circuit chip 2018to interconnect to the conductive layer 2004. In one embodiment, aprotective layer 2020 is placed over the conductive layer 2004 and theRFID integrated circuit chip 2018.

In some instances, the substrate 2060, the conductive layer 2004, theRFID integrated circuit chip 2018 (or the RFID integrated circuit chip2018 recessed in the strap substrate 2014), and the protective layer2020 are assembled together and then placed over the opening 2010 of thebottle 2000. The assembly with all the components thus acts as atamper-proof sealing as well as an RFID tag for the bottle 2000. In thisembodiment, the material or content within the bottle 2000 can beauthenticated, tagged, controlled, and/or protected using a conventionalRFID system that works with the RFID tag installed on the bottle 2000.Additionally, no new complicated processing step is needed to add to theassembling or packaging of the bottle 2000 to add an RFID feature to thebottle 2000.

FIG. 34 illustrates an exemplary web process 7000 of assembling apackaging, such as a Blister Pack, that houses one or more items, suchas a medicine tablet. The particular Blister Pack is assembled toinclude an RFID transponder so that the Blister Pack can be atamper-proof packaging for the medicine tablet as well as providing atagging and authentication tool for the medicine tablet. It is to benoted that although a web processing is convenient for assembling thepackaging for the item with the Blister Pack, other processing methodcan be used.

At location 7001, material for an RFID strap substrate 7010 is provided.In one embodiment, the RFID strap substrate 7010 is provided in a rollformat. At location 7002, recesses 7011 are created into the strapsubstrate 7010 using a tool 7003, which could be a molding tool or anembossing device. Each recess 7011 is configured to receive an RFIDintegrated circuit chip. Each recess 7011 may have a shape complimentaryto the shape of the RFID integrated circuit chip as previouslydiscussed. After the recess 7011 is created, the strap substrate 7010 isadvanced to location 7004. At the location 7004, an RFID integratedcircuit chip 7012 is deposited into the recess 7011. The RFID integratedcircuit chip 7012 can be a shaped block or object that includeselectronic component for the RFID integrated circuit chip 7012. In oneembodiment, an FSA process is used to deposit the RFID integratedcircuit chip 7012 into the recess 7011. An inspection tool can beprovided at location 7006. At the location 7006, the strap substrate7010 can be inspected for recesses 7011 that are not filled or properlyfilled with the RFID integrated circuit chips 7012. At the location7006, the RFID integrated circuit chips 7012 can also be inspected forfunctionality and other necessary inspection. At location 7007, inembodiment where the strap substrate 7010 is in a roll format, the webcan be singulated, separated, cut, or sliced to produce individual strapsubstrate 7010 that comprises the RFID integrated circuit chip 7012deposited therein (RFID strap 7090).

At location 7200, a Blister Pack substrate 7201 is provided. In oneembodiment, the Blister Pack substrate 7201 is provided in a rollformat. At location 7202, recesses 7203 are created into the BlisterPack substrate 7201. In alternative embodiments, the Blister Packsubstrate 7207 already includes recesses 7203 created therein. In yetother alternative embodiments, the Blister Pack substrate 7207 includesdesignated areas 7203 reserved for items 7206 (e.g., medicine tablets)to be placed thereon. At location 7205, items 7206 are placed on theBlister Pack substrate 7201. At location 7207, a conductive layer 7208is placed over the Blister Pack substrate 7201. In some embodiments, anadditional layer (not shown) may be placed over the items before theconductive layer 7208 is placed over the Blister Pack substrate 7201.The conductive layer 7208 includes slots (not shown) created therein aspreviously discussed. At location 7210, individual RFID strap 7090 thatcomprises the RFID integrated circuit chip 7012 deposited therein isplaced over the conductive layer 7208 as previously discussed. Theindividual RFID strap 7090 is placed over the conductive layer 7208 in away that enable interconnection between the RFID integrated circuit chip7012 and the conductive layer 7208 as previously discussed. The RFIDintegrated circuit chip 7012 is placed over a portion of the slot thatis formed in the conductive layer 7208. At location 7212, a protectivelayer 7213 is placed over the Blister Pack substrate 7201. At location7214, the Blister Pack substrate 7201 is singulated into individualBlister Pack 7500. Each Blister Pack 7500 includes one or a plurality ofitems 7206 housed between the Blister Pack substrate 7201 and theconductive layer 7208 that includes the RFID integrated circuit chip7012 attached thereto. The Blister Pack 7500 made in accordance toprocess 7000 includes an RFID transponder that can work with acorresponding RFID reader. It is to be noted that other conventionalstep of making a Blister Pack may be added to the process 7000.

FIG. 35 illustrates an exemplary web process 8000 of assembling apackaging, such as a medicine bottle, that houses one or more items,such as a medicine tablet. The particular bottle is assembled to includean RFID transponder so that the bottle can be a tamper-proof packagingfor the medicine tablet as well as providing a tagging andauthentication tool for the medicine tablet. It is to be noted thatalthough a web processing is convenient for assembling the bottle, otherprocessing method can be used.

At location 8001, a conductive layer 8002 is provided. In someembodiments, an additional layer (not shown) may be coupled to theconductive layer 8002. In one embodiment, the conductive layer 8002 isprovided in a roll format. At location 8003, slots are cut into theconductive layer 8002. A cutting tool 8004 is used to cut the slot. Theslot enables the conductive layer 8002 to function as a part of anantenna structure for an RFID transponder/tag. Instead of cutting, anetching or laser cutting tool can also be used to create the slot in theconductive layer 8002. At location 8005, an RFID strap 8006 is placedover the conductive layer 8002. The RFID strap 8006 can be one that iscreated in the process 7000 as previously mentioned (RFID strap 7090).The RFID strap 8006 thus includes an RFID integrated circuit chiprecessed therein (for example, using FSA). In one embodiment, the RFIDstrap 7090 processed at location 7001-7007 previously described inprocess 7000 (FIG. 34) is used for the RFID strap 8006 and coupled tothe conductive layer 8002 at location 8005 (FIG. 35).

In one embodiment, at location 8007, a protective layer 8008 is placedover the conductive layer 8002 that now includes the RFID strap 8006coupled thereto. At location 8009, the conductive layer 8002 with theRFID strap 8006 and protected by the protective layer 8008 is placedover an item 8010. In one embodiment, the item 8010 is a bottle such asthe bottle 2000 previously discussed. In one embodiment, the conductivelayer 8002 with the RFID strap 8006 and protected by the protectivelayer 8008 is placed over an opening of a bottle. A cap 8013 is alsoplaced over the bottle 8010 and a bottle 8012 is then formed. The bottle8012 thus has an RFID transponder incorporated into its sealingproviding tagging, authenticating, and tamper-proofing capability forthe bottle 8012.

FIG. 36 illustrates an exemplary web process 9000 of assembling apackaging, such as a medicine bottle cap that is to be placed over amedicine bottle houses one or more items. The process 9000 is similar tothe process 8000 previous described (FIG. 35) with the exception that aconductive layer with an RFID strap is placed within a cap that can beused for a bottle. The particular bottle that can be used with the capfrom the process 9000 can be conventionally packaged. In the presentembodiment, the cap of the bottle would be the component that includesthe tagging information. The particular bottle may include othernecessary sealing or tamper proof sealing as is known in the art of asdescribed in this document. It is to be noted that although a webprocessing is convenient for assembling the bottle, other processingmethod can be used.

At location 9001, a conductive layer 9002 is provided. In someembodiments, an additional layer (not shown) may be coupled to theconductive layer 9002. In one embodiment, the conductive layer 9002 isprovided in a roll format. At location 9003, slots are cut into theconductive layer 9002. A cutting tool 9004 is used to cut the slot. Theslot enables the conductive layer 9002 to function as a part of anantenna structure for an RFID transponder/tag. Instead of cutting, anetching or laser cutting tool can also be used to create the slot in theconductive layer 9002. At location 9005, an RFID strap 9006 is placedover the conductive layer 9002. The RFID strap 9006 can be one that iscreated in the process 7000 as previously mentioned (RFID strap 7090).The RFID strap 9006 thus includes an RFID integrated circuit chiprecessed therein (for example, using FSA). In one embodiment, the RFIDstrap substrate processed at location 7001-7007 previously described inprocess 7000 (FIG. 34) is used for the RFID strap substrate 9006 andcoupled to the conductive layer 9002 at location 9005 (FIG. 36).

In one embodiment, at location 9007, a protective layer 9008 is placedover the conductive layer 9002 that now includes the RFID strap 9006coupled thereto. At location 9009, the conductive layer 9002 with theRFID strap 9006 and protected by the protective layer 9008 is placedover an item 9010. In one embodiment, the item 9010 is a bottle cap. Thebottle cap 9010 thus has an RFID transponder incorporated therein.

In one embodiment, an item such as a medicine pack, a medicine bottle, afood item, a beverage item, or the like is tagged using an RFIDtransponder that is incorporated into the packing of the item inaccordance to exemplary embodiments of the present invention. The RFIDtransponder is incorporated into the item utilizing a conductive layerthat may be included in the packaging and an RFID integrated circuitchip as previously described. A complimentary RFID reader is provided towork with the RFID transponder. In one embodiment, the RFID transponderincludes information or identification information about the item andcommunicates/transmits the information the RFID reader, which identifiesthe information accordingly and facilitates the tagging, authenticating,distributing, or the like of the item.

In one embodiment, the RFID transponder functions as a security devicefor an item that incorporates the RFID transponder as described. Forinstance, the RFID transponder sends a signal to a security gate whichincludes an RFID reader and is positioned at a particular location asthe item passes through the gate. The RFID transponder allows the itemto be detected and/or checked out. Such security gate may be included ata retailer selling the device, a pharmacy, a drug store, a hospital, orother establishes that distribute or control the item. In oneembodiment, the RFID transponder facilitates sorting and inventorying ofan item that incorporates the RFID transponder as previously described.

In one embodiment, the RFID transponder facilitates shelving,organizing, locating, identifying, or tracking, or other similar task anitem that incorporates the RFID transponder as previously described. AnRFID reader is provided. The RFID reader can scan or pick up signalsfrom the item's RFID transponder and enters or checks the location ofthe device which facilitates shelving, organizing, locating,identifying, tracking, or other similar task of the item.

Other aspects of the invention relate to content protection. Forexample, an RFID IC may be integrated with an item such as apharmaceutical product and may, (in addition to or an alternative toidentifying, through a contactless, wireless manner, the particularitem) provide a way to prevent distribution of non-genuine product orreplica of the item. In this example, the RFID IC is embedded within thepackaging of the item (e.g., protective sealing). When the sealing isbroken or otherwise tampered with, the item cannot be authenticated.There are numerous possible implementations for protecting the contentof such an item with an RFID IC incorporated within the protectivesealing. One implementation may merely involve wireless by reading orsearching for a code or value from the RFID IC that is originallyinstalled in the sealing. If the codes or values match and can be foundin the item, then the item is authenticated. If the codes or values donot match, or simply does not exist in the sealing, then the item is notauthenticated and a consumer can be alerted as to the authenticity ofthe item.

While the invention has been described in terms of several embodiments,those of ordinary skill in the art will recognize that the invention isnot limited to the embodiments described. The method and apparatus ofthe invention, but can be practiced with modification and alterationwithin the spirit and scope of the appended claims. The description isthus to be regarded as illustrative instead of limiting.

Having disclosed exemplary embodiments, modifications and variations maybe made to the disclosed embodiments while remaining within the spiritand scope of the invention as defined by the appended claims.

1. A device comprising: a first substrate layer having a metallizationlayer formed on a surface of the first substrate layer, wherein aportion of the first substrate layer is not covered by the metallizationlayer; wherein the metallization layer serves a normal function for thedevice; a radio frequency identification (RFID) chip coupled to theportion of the first substrate layer not covered by the metallizationlayer, without making contact with the metallization layer; a conductivelayer which couples the RFID chip to the metallization layer, whereinthe metallization layer serves an additional function as an antenna forthe RFID chip, such that the normal function of the metallization layeris not affected by the coupling.
 2. The device of claim 1 wherein theconductive layer has a configuration selected from a group consisting ofloop, circular, straight, curved, folded, and dipole.
 3. The device ofclaim 1 wherein the RFID chip is deposited in a second substrate havinga receptor configured to receive the RFID chip and wherein the secondsubstrate is adhered to the first substrate layer such that the RFIDchip is interconnected to the conductive layer.
 4. The device of claim 3wherein the RFID chip is deposited in the second substrate using afluidic-self-assembly (FSA) process.
 5. The device of claim 3 whereinthe RFID chip is recessed below a surface of the second substrate. 6.The device of claim 4 wherein the FSA process is performed with a webmaterial in which a web material for the second substrate is provided.7. The device of claim 3 wherein the RFID chip is configured with apredetermined shape and size and the receptor is configured with acomplimentary shape and size to the RFID chip.
 8. A method for creatinga device comprising: forming a metallization layer on a surface of afirst substrate layer, wherein a portion of the first substrate layer isnot covered by the metallization layer; wherein the metallization layerserves a normal function of the device; coupling a radio frequencyidentification (RFID) chip to the portion of the first substrate layernot covered by the metallization layer, without making contact with themetallization layer; coupling the RFID chip to the metallization layerby forming a conductive layer on the first substrate which extends fromthe RFID chip to the metallization layer, wherein the metallizationlayer serves an additional function as an antenna for the RFID chip,such that the normal function of the metallization layer is not affectedby the coupling of the RFID chip to the metallization layer.
 9. Themethod of claim 8 wherein the conductive layer has a configurationselected from a group consisting of loop, circular, straight, curved,folded, and dipole.
 10. The method of claim 8 further comprising:placing a cap layer over the conductive layer and the RFID chip.
 11. Themethod of claim 8 further comprising: recessing the RFID chip into asecond substrate; and coupling the second substrate to the firstsubstrate layer such that the RFID chip is interconnected to theconductive layer.
 12. The method of claim 11 wherein the recessing theRFID chip into the second substrate further comprises depositing theRFID chip into a receptor created in the second substrate using afluidic-self-assembly (FSA) process.
 13. The method of claim 11 whereinthe RFID chip is recessed below a surface of the second substrate. 14.The method of claim 11 wherein an insulation layer is formed on top ofthe RFID chip.
 15. The method of claim 12 wherein the FSA process isperformed with a web material in which a web material is provided forthe second substrate.